Patent Assignment Details
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| Reel/Frame: | 043143/0846 | |
| Pages: | 7 |
| | Recorded: | 07/31/2017 | | |
| Attorney Dkt #: | 252039-1060 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/18/2020
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Application #:
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15664156
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Filing Dt:
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07/31/2017
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Publication #:
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Pub Dt:
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02/15/2018
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Title:
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Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Prepared Using the Same
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Assignee
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| NO. 803, PO AI ST. |
| CHUPEI CITY, HSINCHU COUNTY, TAIWAN |
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Correspondence name and address
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MCCLURE, QUALEY & RODACK, LLP
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3100 INTERSTATE NORTH CIRCLE
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SUITE 150
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ATLANTA, GA 30339
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09/23/2024 02:47 AM
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