Patent Assignment Details
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Reel/Frame: | 017538/0847 | |
| Pages: | 3 |
| | Recorded: | 02/01/2006 | | |
Attorney Dkt #: | MAM-073 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11344250
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Filing Dt:
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02/01/2006
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Publication #:
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Pub Dt:
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12/27/2007
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Title:
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Heatcurable dielectric resin composition and heatcurable dielectric resin film
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Assignee
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2-1-2, OYODOKITA, KITA-KU, OSAKA-SHI |
OSAKA, JAPAN 531-8511 |
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Correspondence name and address
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KUBOVCIK & KUBOVCIK
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THE FARRAGUT BUILDING
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900 17TH STREET, N.W., SUITE 710
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WASHINGTON, DC 20006
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