Patent Assignment Details
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Reel/Frame: | 012029/0848 | |
| Pages: | 3 |
| | Recorded: | 07/30/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09545996
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Filing Dt:
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04/10/2000
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Title:
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Ball-grid array integrated circuit package with an unembedded type of heat-dissipation structure and method of manufacturing the same
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Assignee
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NO. 123, SEC. 3, DA FONG ROAD |
TANTZU TAICHUNG, TAIWAN R.O.C |
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Correspondence name and address
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DIKE, BRONSTEIN, ROBERTS & CUSHMAN
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PETER F. CORLESS
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INTELLECTUAL PROPERTY GROUP OF ET AL
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P.O. BOX 9169
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BOSTON, MA 02209
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