Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 067569/0848 | |
| Pages: | 10 |
| | Recorded: | 05/30/2024 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY DATA FROM STATS CHIPPAC PTE. LTE. TO STATS CHIPPAC PTE. LTD. PREVIOUSLY RECORDED AT REEL: 38378 FRAME: 427. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/08/2016
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Application #:
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12882728
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Filing Dt:
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09/15/2010
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Publication #:
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Pub Dt:
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01/06/2011
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Title:
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Chip Scale Module Package in BGA Semiconductor Package
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Assignee
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE |
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Correspondence name and address
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YANGZHOU DU
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8407 CENTRAL AVE, SUITE 2077
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NEWARK, CA 94560-3431
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