Patent Assignment Details
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Reel/Frame: | 012128/0849 | |
| Pages: | 7 |
| | Recorded: | 08/27/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09940223
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Filing Dt:
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08/27/2001
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Publication #:
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Pub Dt:
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02/27/2003
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Title:
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Tool for embossing high aspect ratio microstructures
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Assignee
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7755 E. MARGINAL WAY |
SEATTLE, WASHINGTON 98108 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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MARK D. ELCHUK AND KELLY K. BURRIS
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5445 CORPORATE DRIVE
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SUITE 400
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TROY, MI 48098-2683
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