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Patent Assignment Details
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Reel/Frame:013710/0849   Pages: 3
Recorded: 01/22/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/25/2005
Application #:
10351534
Filing Dt:
01/27/2003
Publication #:
Pub Dt:
04/22/2004
Title:
WAFER-LEVEL PACKAGE FOR MICRO-ELECTRO-MECHANICAL SYSTEMS
Assignors
1
Exec Dt:
12/03/2002
2
Exec Dt:
12/19/2002
3
Exec Dt:
12/20/2002
4
Exec Dt:
12/19/2002
Assignee
1
11 SCIENCE PARK ROAD
SINGAPORE SCIENCE PARK II
SINGAPORE, SINGAPORE 117685
Correspondence name and address
NATH & ASSOCIATES PLLC
HAROLD L. NOVICK
1030 FIFTEENTH STREET, N.W.
SIXTH FLOOR
WASHINGTON, D.C. 20005

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