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Reel/Frame:048232/0849   Pages: 35
Recorded: 02/04/2019
Attorney Dkt #:030786-0725
Conveyance: RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Total properties: 60
1
Patent #:
6090493
Issue Dt:
07/18/2000
Application #:
08704510
Filing Dt:
12/26/1996
Title:
BISMUTH COATING PROTECTION FOR COPPER
2
Patent #:
5904782
Issue Dt:
05/18/1999
Application #:
08785699
Filing Dt:
01/17/1997
Title:
EPOXY BASED, VOC-FREE SOLDERING FLUX
3
Patent #:
5955141
Issue Dt:
09/21/1999
Application #:
08932392
Filing Dt:
09/17/1997
Title:
PROCESS FOR SILVER PLATING IN PRINTED CIRCUIT BOARD MANUFACTURE
4
Patent #:
6096808
Issue Dt:
08/01/2000
Application #:
09015164
Filing Dt:
01/29/1998
Title:
SNAP CURE ADHESIVE BASED ON ANHYDRIDE/EPOXY RESINS
5
Patent #:
6265776
Issue Dt:
07/24/2001
Application #:
09067381
Filing Dt:
04/27/1998
Title:
FLIP CHIP WITH INTEGRATED FLUX AND UNDERFILL
6
Patent #:
6123024
Issue Dt:
09/26/2000
Application #:
09231490
Filing Dt:
01/14/1999
Title:
STENCIL INCORPORATING ELECTRONIC TAG
7
Patent #:
6228678
Issue Dt:
05/08/2001
Application #:
09266166
Filing Dt:
03/10/1999
Title:
FLIP CHIP WITH INTEGRATED MASK AND UNDERFILL
8
Patent #:
6194788
Issue Dt:
02/27/2001
Application #:
09266232
Filing Dt:
03/10/1999
Title:
FLIP CHIP WITH INTEGRATED FLUX AND UNDERFILL
9
Patent #:
6319543
Issue Dt:
11/20/2001
Application #:
09282729
Filing Dt:
03/31/1999
Title:
PROCESS FOR SILVER PLATING IN PRINTED CIRCUIT BOARD MANUFACTURE
10
Patent #:
6294220
Issue Dt:
09/25/2001
Application #:
09345675
Filing Dt:
06/30/1999
Title:
POST-TREATMENT FOR COPPER ON PRINTED CIRCUIT BOARDS
11
Patent #:
6323062
Issue Dt:
11/27/2001
Application #:
09395553
Filing Dt:
09/14/1999
Title:
WAFER COATING METHOD FOR FLIP CHIPS
12
Patent #:
6228681
Issue Dt:
05/08/2001
Application #:
09395558
Filing Dt:
09/14/1999
Title:
FLIP CHIP HAVING INTEGRAL MASK AND UNDERFILL PROVIDING TWO-STAGE BUMP FORMATION
13
Patent #:
6599372
Issue Dt:
07/29/2003
Application #:
09728264
Filing Dt:
12/01/2000
Publication #:
US20010042775
Pub Dt:
11/22/2001
Title:
SOLDERING FLUX
14
Patent #:
6524398
Issue Dt:
02/25/2003
Application #:
09834196
Filing Dt:
04/12/2001
Publication #:
US20020017337
Pub Dt:
02/14/2002
Title:
LOW-RESIDUE, LOW-SOLDER-BALL FLUX
15
Patent #:
6936115
Issue Dt:
08/30/2005
Application #:
10036952
Filing Dt:
12/21/2001
Publication #:
US20020187264
Pub Dt:
12/12/2002
Title:
SOLDERING FLUX VEHICLE ADDITIVE AND FINE PITCH PRINTING METHOD
16
Patent #:
6653741
Issue Dt:
11/25/2003
Application #:
10151741
Filing Dt:
05/20/2002
Publication #:
US20020175403
Pub Dt:
11/28/2002
Title:
THERMAL INTERFACE MATERIAL AND HEAT SINK CONFIGURATION
17
Patent #:
7097806
Issue Dt:
08/29/2006
Application #:
10363420
Filing Dt:
08/15/2003
Publication #:
US20050097990
Pub Dt:
05/12/2005
Title:
RAPID SURFACE COOLING OF SOLDER DROPLETS BY FLASH EVAPORATION
18
Patent #:
7166491
Issue Dt:
01/23/2007
Application #:
10458925
Filing Dt:
06/11/2003
Publication #:
US20040251561
Pub Dt:
12/16/2004
Title:
THERMOPLASTIC FLUXING UNDERFILL COMPOSITION AND METHOD
19
Patent #:
7187083
Issue Dt:
03/06/2007
Application #:
10722288
Filing Dt:
11/25/2003
Publication #:
US20040200879
Pub Dt:
10/14/2004
Title:
THERMAL INTERFACE MATERIAL AND SOLDER PREFORMS
20
Patent #:
7213739
Issue Dt:
05/08/2007
Application #:
10817138
Filing Dt:
04/02/2004
Publication #:
US20050218195
Pub Dt:
10/06/2005
Title:
UNDERFILL FLUXING CURATIVE
21
Patent #:
7585549
Issue Dt:
09/08/2009
Application #:
10888286
Filing Dt:
07/09/2004
Publication #:
US20050106329
Pub Dt:
05/19/2005
Title:
METHOD OF APPLYING A PATTERN OF PARTICLES TO A SUBSTRATE
22
Patent #:
7413771
Issue Dt:
08/19/2008
Application #:
10888619
Filing Dt:
07/09/2004
Publication #:
US20050100735
Pub Dt:
05/12/2005
Title:
COATING SOLDER METAL PARTICLES WITH A CHARGE DIRECTOR MEDIUM
23
Patent #:
7093746
Issue Dt:
08/22/2006
Application #:
10899679
Filing Dt:
07/26/2004
Publication #:
US20040261636
Pub Dt:
12/30/2004
Title:
COATED STENCIL WITH REDUCED SURFACE TENSION
24
Patent #:
7247683
Issue Dt:
07/24/2007
Application #:
10911908
Filing Dt:
08/05/2004
Publication #:
US20060030682
Pub Dt:
02/09/2006
Title:
LOW VOIDING NO FLOW FLUXING UNDERFILL FOR ELECTRONIC DEVICES
25
Patent #:
7533793
Issue Dt:
05/19/2009
Application #:
11012457
Filing Dt:
12/15/2004
Publication #:
US20050184129
Pub Dt:
08/25/2005
Title:
SOLDER PREFORMS FOR USE IN ELECTRONIC ASSEMBLY
26
Patent #:
7413805
Issue Dt:
08/19/2008
Application #:
11065764
Filing Dt:
02/25/2005
Publication #:
US20060192182
Pub Dt:
08/31/2006
Title:
PREPARATION OF METALLIC PARTICLES FOR ELECTROKINETIC OR ELECTROSTATIC DEPOSITION
27
Patent #:
7678255
Issue Dt:
03/16/2010
Application #:
11419128
Filing Dt:
05/18/2006
Publication #:
US20060260943
Pub Dt:
11/23/2006
Title:
MASK AND METHOD FOR ELECTROKINETIC DEPOSITION AND PATTERNING PROCESS ON SUBSTRATES
28
Patent #:
7968008
Issue Dt:
06/28/2011
Application #:
11462089
Filing Dt:
08/03/2006
Publication #:
US20080032047
Pub Dt:
02/07/2008
Title:
PARTICLES AND INKS AND FILMS USING THEM
29
Patent #:
7663242
Issue Dt:
02/16/2010
Application #:
11682729
Filing Dt:
03/06/2007
Publication #:
US20070145546
Pub Dt:
06/28/2007
Title:
THERMAL INTERFACE MATERIAL AND SOLDER PREFORMS
30
Patent #:
9221131
Issue Dt:
12/29/2015
Application #:
11720578
Filing Dt:
07/25/2008
Publication #:
US20080292492
Pub Dt:
11/27/2008
Title:
Solder Alloy
31
Patent #:
8597548
Issue Dt:
12/03/2013
Application #:
11857818
Filing Dt:
09/19/2007
Publication #:
US20080145560
Pub Dt:
06/19/2008
Title:
SOLVENT SYSTEMS FOR METALS AND INKS
32
Patent #:
9615463
Issue Dt:
04/04/2017
Application #:
11857871
Filing Dt:
09/19/2007
Publication #:
US20080137316
Pub Dt:
06/12/2008
Title:
METHOD FOR PRODUCING A HIGH-ASPECT RATIO CONDUCTIVE PATTERN ON A SUBSTRATE
33
Patent #:
10123430
Issue Dt:
11/06/2018
Application #:
11873838
Filing Dt:
10/17/2007
Publication #:
US20080173698
Pub Dt:
07/24/2008
Title:
MATERIALS FOR USE WITH INTERCONNECTS OF ELECTRICAL DEVICES AND RELATED METHODS
34
Patent #:
8641964
Issue Dt:
02/04/2014
Application #:
12036497
Filing Dt:
02/25/2008
Publication #:
US20080159903
Pub Dt:
07/03/2008
Title:
SOLDER ALLOY
35
Patent #:
8191757
Issue Dt:
06/05/2012
Application #:
12036604
Filing Dt:
02/25/2008
Publication #:
US20080160310
Pub Dt:
07/03/2008
Title:
REDUCING JOINT EMBRITTLEMENT IN LEAD-FREE SOLDERING PROCESSES
36
Patent #:
9362424
Issue Dt:
06/07/2016
Application #:
12052104
Filing Dt:
03/20/2008
Publication #:
US20080245765
Pub Dt:
10/09/2008
Title:
ELECTRICAL CONTACTS
37
Patent #:
8312623
Issue Dt:
11/20/2012
Application #:
12052166
Filing Dt:
03/20/2008
Publication #:
US20080236874
Pub Dt:
10/02/2008
Title:
METHODS FOR PRODUCING ELECTRICAL CONDUCTORS
38
Patent #:
8555491
Issue Dt:
10/15/2013
Application #:
12175375
Filing Dt:
07/17/2008
Publication #:
US20090025967
Pub Dt:
01/29/2009
Title:
METHODS OF ATTACHING A DIE TO A SUBSTRATE
39
Patent #:
8304062
Issue Dt:
11/06/2012
Application #:
12175381
Filing Dt:
07/17/2008
Publication #:
US20090061169
Pub Dt:
03/05/2009
Title:
ELECTRICAL CONDUCTORS AND METHODS OF MAKING AND USING THEM
40
Patent #:
8252417
Issue Dt:
08/28/2012
Application #:
12191691
Filing Dt:
08/14/2008
Publication #:
US20080296540
Pub Dt:
12/04/2008
Title:
METALLIC PARTICLES FOR ELECTROKINETIC OR ELECTROSTATIC DEPOSITION
41
Patent #:
7655304
Issue Dt:
02/02/2010
Application #:
12191710
Filing Dt:
08/14/2008
Publication #:
US20080299394
Pub Dt:
12/04/2008
Title:
COATED SOLDER METAL PARTICLES
42
Patent #:
7749883
Issue Dt:
07/06/2010
Application #:
12201654
Filing Dt:
08/29/2008
Publication #:
US20090081823
Pub Dt:
03/26/2009
Title:
ELECTROFORMED STENCILS FOR SOLAR CELL FRONT SIDE METALLIZATION
43
Patent #:
NONE
Issue Dt:
Application #:
12497065
Filing Dt:
07/02/2009
Publication #:
US20100139952
Pub Dt:
06/10/2010
Title:
FLUX FORMULATIONS
44
Patent #:
8564140
Issue Dt:
10/22/2013
Application #:
12567523
Filing Dt:
09/25/2009
Publication #:
US20100084757
Pub Dt:
04/08/2010
Title:
MONO-ACID HYBRID CONDUCTIVE COMPOSITION AND METHOD
45
Patent #:
9217088
Issue Dt:
12/22/2015
Application #:
13168465
Filing Dt:
06/24/2011
Publication #:
US20110318478
Pub Dt:
12/29/2011
Title:
PARTICLES AND INKS AND FILMS USING THEM
46
Patent #:
10535628
Issue Dt:
01/14/2020
Application #:
13287820
Filing Dt:
11/02/2011
Publication #:
US20120114927
Pub Dt:
05/10/2012
Title:
SINTERING MATERIALS AND ATTACHMENT METHODS USING SAME
47
Patent #:
RE45279
Issue Dt:
12/09/2014
Application #:
13471203
Filing Dt:
05/14/2012
Title:
PROCESS FOR SILVER PLATING IN PRINTED CIRCUIT BOARD MANUFACTURE
48
Patent #:
RE45175
Issue Dt:
10/07/2014
Application #:
13655159
Filing Dt:
10/18/2012
Title:
PROCESS FOR SILVER PLATING IN PRINTED CIRCUIT BOARD MANUFACTURE
49
Patent #:
10905041
Issue Dt:
01/26/2021
Application #:
14027530
Filing Dt:
09/16/2013
Publication #:
US20140153203
Pub Dt:
06/05/2014
Title:
METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS
50
Patent #:
9355938
Issue Dt:
05/31/2016
Application #:
14058553
Filing Dt:
10/21/2013
Publication #:
US20140153167
Pub Dt:
06/05/2014
Title:
CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM
51
Patent #:
9566668
Issue Dt:
02/14/2017
Application #:
14077995
Filing Dt:
11/12/2013
Publication #:
US20140060703
Pub Dt:
03/06/2014
Title:
FLUX FORMULATIONS
52
Patent #:
NONE
Issue Dt:
Application #:
14095559
Filing Dt:
12/03/2013
Publication #:
US20140186524
Pub Dt:
07/03/2014
Title:
SOLVENT SYSTEMS FOR METALS AND INKS
53
Patent #:
NONE
Issue Dt:
Application #:
14236432
Filing Dt:
03/21/2014
Publication #:
US20140219711
Pub Dt:
08/07/2014
Title:
HIGH IMPACT TOUGHNESS SOLDER ALLOY
54
Patent #:
NONE
Issue Dt:
Application #:
14236480
Filing Dt:
03/21/2014
Publication #:
US20140199115
Pub Dt:
07/17/2014
Title:
SOLDER COMPOSITIONS
55
Patent #:
NONE
Issue Dt:
Application #:
14347035
Filing Dt:
03/25/2014
Publication #:
US20140328039
Pub Dt:
11/06/2014
Title:
SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT
56
Patent #:
9801285
Issue Dt:
10/24/2017
Application #:
14386601
Filing Dt:
09/19/2014
Publication #:
US20150078810
Pub Dt:
03/19/2015
Title:
SOLDER PREFORMS AND SOLDER ALLOY ASSEMBLY METHODS
57
Patent #:
NONE
Issue Dt:
Application #:
14434470
Filing Dt:
04/09/2015
Publication #:
US20150266137
Pub Dt:
09/24/2015
Title:
LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
58
Patent #:
10259980
Issue Dt:
04/16/2019
Application #:
14438888
Filing Dt:
04/28/2015
Publication #:
US20150353804
Pub Dt:
12/10/2015
Title:
SINTERING POWDER
59
Patent #:
11090768
Issue Dt:
08/17/2021
Application #:
14698450
Filing Dt:
04/28/2015
Publication #:
US20150224604
Pub Dt:
08/13/2015
Title:
LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
60
Patent #:
NONE
Issue Dt:
Application #:
14878056
Filing Dt:
10/08/2015
Publication #:
US20160023309
Pub Dt:
01/28/2016
Title:
LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
Assignor
1
BARCLAYS BANK PLC, AS COLLATERAL AGENT
Exec Dt:
01/31/2019
Assignee
1
ALPHA ASSEMBLY SOLUTIONS INC. (F/K/A ALPHA METALS, INC.)
300 ATRIUM DRIVE
3RD FLOOR
SOMERSET, NEW JERSEY 08873
Correspondence name and address
LATHAM & WATKINS LLP C/O ANGELA M. AMARU
885 THIRD AVENUE
NEW YORK, NY 10022

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