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Total properties:
21
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Patent #:
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Issue Dt:
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09/22/1992
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Application #:
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07602504
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Filing Dt:
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10/24/1990
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Title:
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RAPID-CURING ADHESIVE FORMULATION FOR SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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10/13/1992
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Application #:
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07804116
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Filing Dt:
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12/06/1991
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Title:
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RAPID-CURING ADHESIVE FORMULATION FOR SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
|
03/23/1993
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Application #:
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07843735
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Filing Dt:
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02/28/1992
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Title:
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METHOD OF REDUCING MOISTURE CONTENT OF HERMETIC PACKAGES CONTAINING SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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10/05/1993
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Application #:
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07890618
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Filing Dt:
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05/28/1992
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Title:
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LOW TEMPERATURE FLEXIBLE DIE ATTACH ADHESIVE AND ARTICLES USING SAME
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Patent #:
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Issue Dt:
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03/21/1995
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Application #:
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08068408
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Filing Dt:
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05/27/1993
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Title:
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LOW TEMPERATURE FLEXIBLE DIE ATTACH ADHESIVE AND ARTICLES USING SAME
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Patent #:
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Issue Dt:
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01/31/1995
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Application #:
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08162389
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Filing Dt:
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12/03/1993
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Title:
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LOW TEMPERATURE FLEXIBLE DIE ATTACH ADHESIVE AND ARTICLES USING SAME
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|
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Patent #:
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Issue Dt:
|
12/06/1994
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Application #:
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08162390
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Filing Dt:
|
12/03/1993
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Title:
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RAPIDLY CURING ADHESIVE AND METHOD
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|
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Patent #:
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|
Issue Dt:
|
02/06/1996
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Application #:
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08392602
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Filing Dt:
|
02/22/1995
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|
Title:
|
LOW TEMPERATURE FLEXIBLE DIE ATTACH ADHESIVE AND ARTICLES USING SAME
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|
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Patent #:
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|
Issue Dt:
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06/11/1996
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Application #:
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08431685
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Filing Dt:
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05/02/1995
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Title:
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MATERIALS WITH LOW MOISTURE OUTGASSING PROPERTIES AND METHOD OF REDUCING MOISTURE CONTENT OF HERMETIC PACKAGES CONTAINING SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
|
03/18/1997
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Application #:
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08543321
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Filing Dt:
|
10/16/1995
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Title:
|
LOW TEMPERATURE FLEXIBLE DIE ATTACH ADHESIVE AND ARTICLES USING SAME
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|
|
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Patent #:
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|
Issue Dt:
|
01/05/1999
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Application #:
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08577256
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Filing Dt:
|
12/22/1995
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|
Title:
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MATERIALS FOR SEMICONDUCTOR DEVICE ASSEMBLIES
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|
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Patent #:
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|
Issue Dt:
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07/21/1998
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Application #:
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08664200
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Filing Dt:
|
06/10/1996
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Title:
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METHOD OF DECREASING BLEED FROM ORGANIC-BASED FORMULATIONS AND ANTI- BLEED COMPOSITIONS
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|
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Patent #:
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Issue Dt:
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01/13/1998
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Application #:
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08680705
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Filing Dt:
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07/17/1996
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Title:
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DIE ATTACH ADHESIVE WITH REDUCED RESIN BLEED
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|
|
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Patent #:
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|
Issue Dt:
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12/22/1998
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Application #:
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08798863
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Filing Dt:
|
02/11/1997
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|
Title:
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ORGANOSILICON-CONTAINING COMPOSITIONS HAVING ENHANCED ADHESIVE PROPERTIES
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|
|
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Patent #:
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|
Issue Dt:
|
01/12/1999
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Application #:
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08798864
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Filing Dt:
|
02/11/1997
|
|
Title:
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ORGANOSILICON-CONTAINING COMPOSITIONS CAPABLE OF RAPID CURING AT LOW TEMPERATURE
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|
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Patent #:
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|
Issue Dt:
|
06/15/1999
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Application #:
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08859792
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Filing Dt:
|
05/19/1997
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|
Title:
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FLEXIBLE INTERPENETRATING NETWORKS FORMED BY EPOXY-CYANATE ESTER COMPOSITIONS VIA A POLYAMIDE
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|
|
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Patent #:
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|
Issue Dt:
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04/28/1998
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Application #:
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08868508
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Filing Dt:
|
06/04/1997
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|
Title:
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ADHESIVE COMPOSITION FOR BONDING A SEMICONDUCTOR DEVICE
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|
|
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Patent #:
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|
Issue Dt:
|
01/12/1999
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Application #:
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08935575
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Filing Dt:
|
09/23/1997
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|
Title:
|
METHOD OF DECREASING BLEED FROM ORGANIC-BASED FORMULATIONS AND ANTI-BLEED COMPOSITIONS
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|
|
|
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Patent #:
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|
Issue Dt:
|
09/12/2000
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Application #:
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09109976
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Filing Dt:
|
07/02/1998
|
|
Title:
|
RESIN SYSTEMS FOR ORGANOSILICON-CONTAINING COMPOSITIONS
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|
|
|
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Patent #:
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|
Issue Dt:
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05/02/2000
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Application #:
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09133507
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Filing Dt:
|
08/12/1998
|
|
Title:
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LONG AND SHORT-CHAIN CYCLOALIPHATIC EPOXY RESINS WITH CYANATE ESTER
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|
|
|
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Patent #:
|
|
Issue Dt:
|
06/05/2001
|
Application #:
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09416706
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Filing Dt:
|
10/12/1999
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|
Title:
|
METHOD OF APPLYING A DIE ATTACH ADHESIVE
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