Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 015958/0850 | |
| Pages: | 3 |
| | Recorded: | 11/08/2004 | | |
| Attorney Dkt #: | BA-00564-PCT-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10504230
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Filing Dt:
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08/10/2004
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Publication #:
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Pub Dt:
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04/14/2005
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Title:
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Method for stacking chips within a multichip module package
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Assignee
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| 65 SPIT BROOK ROAD |
| NASHUA, NEW HAMPSHIRE 03060 |
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Correspondence name and address
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DILLON & YUDELL LLP
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8911 N. CAPITAL OF TEXAS HWY.
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SUITE 2110
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AUSTIN, TEXAS 78759
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