Patent Assignment Details
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Reel/Frame: | 059553/0851 | |
| Pages: | 2 |
| | Recorded: | 03/30/2022 | | |
Attorney Dkt #: | BABA-A35159US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17670394
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Filing Dt:
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02/11/2022
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Publication #:
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Pub Dt:
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08/17/2023
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Title:
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SUBSTRATE, CHIP, CIRCUIT PACKAGE AND FABRICATION PROCESS
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Assignee
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RM. 508 5TH FLOOR, TOWER 4 |
699 WANG SHANG ROAD, BINJIANG DISTRICT |
HANGZHOU, ZHEIJIANG PROVENCE, CHINA 310052 |
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Correspondence name and address
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MURABITO, HAO & BARNES LLP
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111 NORTH MARKET STREET
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SUITE 700
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SAN JOSE, 95113 UNITED STATES
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06/17/2024 04:18 AM
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