Patent Assignment Details
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Reel/Frame: | 013250/0852 | |
| Pages: | 3 |
| | Recorded: | 08/30/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/29/2004
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Application #:
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10232344
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Filing Dt:
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08/30/2002
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Publication #:
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Pub Dt:
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05/01/2003
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Title:
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SEMICONDUCTOR PACKAGE HAVING THERMAL INTERFACE MATERIAL (TIM)
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Assignee
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SAN 16, BANWOI, RI, TAEAN-EUB, HWASUNG-CITY |
GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MARGER JOHNSON & MCCOLLOM, P.C.
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ALAN T. MCCOLLOM
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1030 S.W. MORRISON STREET
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PORTLAND, OREGON 97205
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