Patent Assignment Details
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Reel/Frame: | 007834/0854 | |
| Pages: | 2 |
| | Recorded: | 03/04/1996 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/01/2001
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Application #:
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08567949
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Filing Dt:
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12/06/1995
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Title:
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A PACKAGE FOR A SEMICONDUCTOR ELEMENT HAVING DEPRESSIONS CONTAINING SOLDER TERMINALS
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Assignee
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5-22, KITA INOUE-CHO, HIGASHINO |
YAMASHINA-KU, KYOTO, JAPAN |
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Correspondence name and address
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LOEB & LOEB LLP
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ROGER R. WISE
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10100 SANTA MONICA BLVD., SUITE 2200
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LOS ANGELES, CA 90067-4164
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