Patent Assignment Details
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| Reel/Frame: | 017868/0857 | |
| Pages: | 3 |
| | Recorded: | 06/29/2006 | | |
| Attorney Dkt #: | MEG02-009 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/30/2007
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Application #:
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10434524
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Filing Dt:
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05/08/2003
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Publication #:
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Pub Dt:
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04/15/2004
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Title:
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FABRICATION OF WIRE BOND PADS OVER UNDERLYING ACTIVE DEVICES, PASSIVE DEVICES AND /OR DIELECTRIC LAYERS IN INTEGRATED CIRCUITS
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Assignee
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| ROOM 301/302, NO. 47, PARK 2ND RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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Correspondence name and address
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SAILE ACKERMAN, LLC
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28 DAVIS AVENUE
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POUGHKEEPSIE, NY 12603
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