Patent Assignment Details
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Reel/Frame: | 019644/0857 | |
| Pages: | 4 |
| | Recorded: | 07/23/2007 | | |
Attorney Dkt #: | 796/77839 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11799823
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Filing Dt:
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05/03/2007
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Publication #:
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Pub Dt:
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11/29/2007
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Title:
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Method for fabricating a pressure sensor using SOI wafers
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Assignee
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LAUBISRUTISTRASSE 50 CH-8712 |
STAFA, SWITZERLAND |
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Correspondence name and address
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RICHARD F JAWORSKI, ESQ.
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COOPER & DUNHAMLLP
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1185 AVENUE OF AMERICAS
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NEW YORK, N.Y. 10036
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05/30/2024 05:42 PM
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