Patent Assignment Details
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Reel/Frame: | 012031/0858 | |
| Pages: | 3 |
| | Recorded: | 07/25/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09912838
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Filing Dt:
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07/25/2001
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Publication #:
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Pub Dt:
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01/30/2003
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Title:
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Bonding pad structure for copper/low-k dielectric material BEOL process
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Assignee
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NO. 3, LI-HSIN RD. 2, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU CITY, TAIWAN R.O.C |
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Correspondence name and address
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POWELL, GOLDSTEIN, FRAZER & MURPHY, LLP
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THOMAS T. MOGA
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P.O. BOX 97223
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WASHINGTON, DC 20090-7223
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