Patent Assignment Details
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Reel/Frame: | 052170/0859 | |
| Pages: | 7 |
| | Recorded: | 08/07/2019 | | |
Attorney Dkt #: | 82148432US01 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE CHANGE TO BE MADE TO ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 49567 FRAME: 302. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/14/2021
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Application #:
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16450064
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Filing Dt:
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06/24/2019
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Publication #:
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Pub Dt:
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12/24/2020
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Title:
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Semiconductor Package with Compact Antenna Formed Using Three-Dimensional Additive Manufacturing Process
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Assignee
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6501 WILLIAM CANNON DRIVE WEST TX30/OE62 |
AUSTIN, TEXAS 78735 |
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Correspondence name and address
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NXP USA, INC. LAW DEPARTMENT
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6501 WILLIAM CANNON DRIVE WEST TX30/OE62
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AUSTIN, TX 78735
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09/21/2024 07:10 AM
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