Patent Assignment Details
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Reel/Frame: | 020759/0860 | |
| Pages: | 4 |
| | Recorded: | 03/20/2008 | | |
Attorney Dkt #: | 01096.0165 |
Conveyance: | RECORD TO CORRECT THE ASSIGNEE'S NAME, PREVIOUSLY RECORDED AT REEL 019940 FRAME 231. CONFIRMS THE ASSIGNMENT |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/14/2012
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Application #:
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11887181
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Filing Dt:
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09/26/2007
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Publication #:
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Pub Dt:
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06/04/2009
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Title:
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CONDUCTIVE FILLER AND SOLDER MATERIAL
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Assignee
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23-7, NISHI-SHINJUKU 1-CHOME, SHINJUKU-KU |
TOKYO 160-0023, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, GARRETT &
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LLP
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901 NEW YORK AVENUE, NW
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WASHINGTON, DC 20001-4413
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