Patent Assignment Details
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Reel/Frame: | 025536/0860 | |
| Pages: | 3 |
| | Recorded: | 12/22/2010 | | |
Attorney Dkt #: | JYO-014 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/01/2011
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Application #:
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12189165
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Filing Dt:
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08/10/2008
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Publication #:
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Pub Dt:
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07/15/2010
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Title:
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LEADLESS SEMICONDUCTOR PACKAGE WITH ELECTROPLATED LAYER EMBEDDED IN ENCAPSULANT AND THE METHOD FOR MANUFACTURING THE SAME
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Assignees
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CANON'S COURT, 22 VICTORIA STREET |
HAMILTOM HM 12, BERMUDA |
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NO. 1, R&D RD. 1, SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN |
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Correspondence name and address
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YEN JUNG SUNG
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30-47 37 ST.
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ASTORIA, NY 11103
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