Patent Assignment Details
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Reel/Frame: | 033542/0860 | |
| Pages: | 3 |
| | Recorded: | 08/15/2014 | | |
Attorney Dkt #: | 1012-0938 / 2014P51266US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/22/2015
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Application #:
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14460463
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Filing Dt:
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08/15/2014
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Title:
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Molded Flip-Clip Semiconductor Package
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Assignee
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AM CAMPEON 1-12 |
NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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MURPHY, BILAK & HOMILLER/INFINEON TECHNO
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8000 REGENCY PARKWAY
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SUITE 415
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CARY, NC 27518
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