Patent Assignment Details
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| Reel/Frame: | 038459/0861 | |
| Pages: | 5 |
| | Recorded: | 05/04/2016 | | |
| Attorney Dkt #: | JCLA61884 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/02/2018
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Application #:
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15146741
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Filing Dt:
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05/04/2016
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Publication #:
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Pub Dt:
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11/09/2017
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Title:
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MICROELECTROMECHANICAL SYSTEM STRUCTURE INCLUDING THERMAL STABILITY LAYER WHOSE MATERIAL HAS HIGHER GROWTH TEMPERATURE, AND METHOD FOR FABRICATING THE SAME
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Assignee
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| NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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Correspondence name and address
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J.C. PATENTS
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4 VENTURE, SUITE 250
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IRVINE, CA 92618
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