Patent Assignment Details
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Reel/Frame: | 057870/0861 | |
| Pages: | 4 |
| | Recorded: | 10/21/2021 | | |
Attorney Dkt #: | JJD-049-1D1C |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/20/2024
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Application #:
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17507653
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Filing Dt:
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10/21/2021
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Publication #:
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Pub Dt:
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02/10/2022
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Title:
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WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE, AND MANUFACTURING METHOD THEREOF
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Assignee
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1913-2, TAKEGASHITA FUKURA |
USUKI-SHI, OITA, JAPAN 875-0053 |
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Correspondence name and address
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LAW OFFICE OF KEVIN JACKSON
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6315 E. CACTUS WREN RD
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PARADISE VALLEY, 85253 UNITED STATES
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06/04/2024 10:13 PM
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