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Reel/Frame:061648/0861   Pages: 5
Recorded: 11/03/2022
Attorney Dkt #:T5389-000
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 22
1
Patent #:
9385070
Issue Dt:
07/05/2016
Application #:
13930817
Filing Dt:
06/28/2013
Publication #:
US20150001692
Pub Dt:
01/01/2015
Title:
SEMICONDUCTOR COMPONENT HAVING A LATERAL SEMICONDUCTOR DEVICE AND A VERTICAL SEMICONDUCTOR DEVICE
2
Patent #:
8912663
Issue Dt:
12/16/2014
Application #:
13930949
Filing Dt:
06/28/2013
Publication #:
US20150001727
Pub Dt:
01/01/2015
Title:
EMBEDDED PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THEREOF
3
Patent #:
9484418
Issue Dt:
11/01/2016
Application #:
14083777
Filing Dt:
11/19/2013
Publication #:
US20140138701
Pub Dt:
05/22/2014
Title:
SEMICONDUCTOR DEVICE
4
Patent #:
8957493
Issue Dt:
02/17/2015
Application #:
14185322
Filing Dt:
02/20/2014
Publication #:
US20150069404
Pub Dt:
03/12/2015
Title:
SEMICONDUCTOR DEVICE
5
Patent #:
9431327
Issue Dt:
08/30/2016
Application #:
14291563
Filing Dt:
05/30/2014
Publication #:
US20150348889
Pub Dt:
12/03/2015
Title:
SEMICONDUCTOR DEVICE
6
Patent #:
9325308
Issue Dt:
04/26/2016
Application #:
14291654
Filing Dt:
05/30/2014
Publication #:
US20150349771
Pub Dt:
12/03/2015
Title:
SEMICONDUCTOR DEVICE AND CASCODE CIRCUIT
7
Patent #:
9190393
Issue Dt:
11/17/2015
Application #:
14333795
Filing Dt:
07/17/2014
Publication #:
US20150340344
Pub Dt:
11/26/2015
Title:
LOW PARASITIC CAPACITANCE SEMICONDUCTOR DEVICE PACKAGE
8
Patent #:
9508843
Issue Dt:
11/29/2016
Application #:
14496471
Filing Dt:
09/25/2014
Publication #:
US20150243657
Pub Dt:
08/27/2015
Title:
HETEROJUNCTION SEMICONDUCTOR DEVICE FOR REDUCING PARASITIC CAPACITANCE
9
Patent #:
10685904
Issue Dt:
06/16/2020
Application #:
14549996
Filing Dt:
11/21/2014
Publication #:
US20160148855
Pub Dt:
05/26/2016
Title:
PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF
10
Patent #:
9324819
Issue Dt:
04/26/2016
Application #:
14555056
Filing Dt:
11/26/2014
Title:
SEMICONDUCTOR DEVICE
11
Patent #:
9793370
Issue Dt:
10/17/2017
Application #:
14721796
Filing Dt:
05/26/2015
Publication #:
US20150349107
Pub Dt:
12/03/2015
Title:
TRANSISTOR WITH OXIDIZED CAP LAYER
12
Patent #:
10229978
Issue Dt:
03/12/2019
Application #:
14724963
Filing Dt:
05/29/2015
Publication #:
US20150357422
Pub Dt:
12/10/2015
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
13
Patent #:
9502548
Issue Dt:
11/22/2016
Application #:
14851218
Filing Dt:
09/11/2015
Title:
SEMICONDUCTOR DEVICE
14
Patent #:
9754932
Issue Dt:
09/05/2017
Application #:
14933059
Filing Dt:
11/05/2015
Publication #:
US20170025406
Pub Dt:
01/26/2017
Title:
SEMICONDUCTOR DEVICE
15
Patent #:
9793390
Issue Dt:
10/17/2017
Application #:
14955481
Filing Dt:
12/01/2015
Publication #:
US20160372557
Pub Dt:
12/22/2016
Title:
LOW MILLER FACTOR SEMICONDUCTOR DEVICE
16
Patent #:
9893015
Issue Dt:
02/13/2018
Application #:
15086556
Filing Dt:
03/31/2016
Publication #:
US20170092642
Pub Dt:
03/30/2017
Title:
SEMICONDUCTOR DEVICE
17
Patent #:
9847312
Issue Dt:
12/19/2017
Application #:
15157896
Filing Dt:
05/18/2016
Publication #:
US20170092570
Pub Dt:
03/30/2017
Title:
PACKAGE STRUCTURE
18
Patent #:
9755044
Issue Dt:
09/05/2017
Application #:
15176446
Filing Dt:
06/08/2016
Publication #:
US20160284816
Pub Dt:
09/29/2016
Title:
METHOD OF MANUFACTURING A TRANSISTOR WITH OXIDIZED CAP LAYER
19
Patent #:
10854720
Issue Dt:
12/01/2020
Application #:
16262352
Filing Dt:
01/30/2019
Publication #:
US20190172915
Pub Dt:
06/06/2019
Title:
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
20
Patent #:
10978403
Issue Dt:
04/13/2021
Application #:
16262421
Filing Dt:
01/30/2019
Publication #:
US20200243453
Pub Dt:
07/30/2020
Title:
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
21
Patent #:
11049796
Issue Dt:
06/29/2021
Application #:
16856797
Filing Dt:
04/23/2020
Publication #:
US20200251405
Pub Dt:
08/06/2020
Title:
MANUFACTURING METHOD OF PACKAGING DEVICE
22
Patent #:
11296195
Issue Dt:
04/05/2022
Application #:
17038693
Filing Dt:
09/30/2020
Publication #:
US20210013312
Pub Dt:
01/14/2021
Title:
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Assignor
1
DELTA ELECTRONICS, INC.
Exec Dt:
10/19/2022
Assignee
1
ANCORA SEMICONDUCTORS INC.
6F., NO. 252, SHANYING RD., GUISHAN DIST.
TAOYUAN CITY, TAIWAN 333425
Correspondence name and address
HAUPTMAN HAM, LLP
2318 MILL ROAD, SUITE 1400
ALEXANDRIA, VA 22314

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