Patent Assignment Details
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Reel/Frame: | 034863/0862 | |
| Pages: | 8 |
| | Recorded: | 02/02/2015 | | |
Attorney Dkt #: | KDU-71921US02 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/30/2015
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Application #:
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14199960
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Filing Dt:
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03/06/2014
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Publication #:
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Pub Dt:
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09/11/2014
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Title:
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Methods and Systems for High Bandwidth Chip-to-Chip Communications Interface
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Assignee
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EPFL INNOVATION PARK |
BUILDING I |
LAUSANNE, SWITZERLAND CH-1015 |
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Correspondence name and address
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INVENTION MINE
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200 SOUTH WACHER DRIVE, SUITE 3100
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ROBERT J. IRVINE III
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CHICAGO, IL 60606
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