Patent Assignment Details
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| Reel/Frame: | 038555/0862 | |
| Pages: | 6 |
| | Recorded: | 05/12/2016 | | |
| Attorney Dkt #: | 1012-1348 / 2015P50308 US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15135155
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Filing Dt:
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04/21/2016
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Publication #:
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Pub Dt:
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10/27/2016
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Title:
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Device Including a Logic Semiconductor Chip Having a Contact Electrode for Clip Bonding
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Assignee
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| SIEMENSSTRASSE 2 |
| VILLACH, AUSTRIA 9500 |
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Correspondence name and address
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MURPHY, BILAK & HOMILLER/INFINEON TECHNO
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1255 CRESCENT GREEN
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SUITE 200
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CARY, NC 27518
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09/23/2024 07:18 PM
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