Patent Assignment Details
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Reel/Frame: | 019641/0863 | |
| Pages: | 5 |
| | Recorded: | 07/12/2007 | | |
Attorney Dkt #: | GS 217 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/29/2011
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Application #:
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11827592
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Filing Dt:
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07/12/2007
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Publication #:
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Pub Dt:
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01/15/2009
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Title:
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SUBASSEMBLY THAT INCLUDES A POWER SEMICONDUCTOR DIE AND A HEAT SINK HAVING AN EXPOSED SURFACE PORTION THEREOF
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Assignee
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100 MOTOR PARKWAY, SUITE 135 |
HAUPPAUGE, NEW YORK 11788 |
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Correspondence name and address
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STUART H. MAYER
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MAYER & WILLIAMS PC
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251 NORTH AVENUE WEST, 2ND FLOOR
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WESTFIELD, NJ 07090
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