Patent Assignment Details
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| Reel/Frame: | 021955/0863 | |
| Pages: | 2 |
| | Recorded: | 12/09/2008 | | |
| Attorney Dkt #: | MR1957-1796 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/25/2011
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Application #:
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12243016
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Filing Dt:
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10/01/2008
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Publication #:
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Pub Dt:
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12/24/2009
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Title:
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LED CHIP PACKAGE STRUCTURE WITH AN EMBEDDED ESD FUNCTION AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| NO. 18, LANE 522 SEC. 5, JHONGHUA RD. |
| HSINCHU CITY, TAIWAN R.O.C. |
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Correspondence name and address
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ROSENBERG, KLEIN & LEE
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3458 ELLICOTT CENTER DRIVE-SUITE 101
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ELLICOTT CITY, MD 21043
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