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237
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3
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Patent #:
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Issue Dt:
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11/30/2010
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Application #:
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12190039
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Filing Dt:
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08/12/2008
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Title:
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SEMICONDUCTOR PACKAGE HAVING THROUGH HOLES
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Patent #:
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Issue Dt:
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12/18/2012
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Application #:
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12204692
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Filing Dt:
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09/04/2008
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Title:
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SEMICONDUCTOR DEVICE HAVING INSULATING AND INTERCONNECTION LAYERS
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Patent #:
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Issue Dt:
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04/06/2010
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Application #:
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12221797
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Filing Dt:
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08/05/2008
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Title:
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TWO-SIDED FAN-OUT WAFER ESCAPE PACKAGE
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Patent #:
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Issue Dt:
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08/31/2010
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Application #:
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12221948
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Filing Dt:
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08/08/2008
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Publication #:
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Pub Dt:
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12/18/2008
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Title:
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CAMERA MODULE WITH WINDOW MECHANICAL ATTACHMENT
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Patent #:
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Issue Dt:
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11/30/2010
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Application #:
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12237173
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Filing Dt:
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09/24/2008
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Title:
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ULTRA THIN PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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12/07/2010
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Application #:
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12242603
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Filing Dt:
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09/30/2008
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Title:
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SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH INCREASED I/O
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Patent #:
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Issue Dt:
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08/02/2011
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Application #:
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12246226
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Filing Dt:
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10/06/2008
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Title:
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INCREASED I/O LEADFRAME AND SEMICONDUCTOR DEVICE INCLUDING SAME
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Patent #:
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Issue Dt:
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08/30/2011
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Application #:
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12259096
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Filing Dt:
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10/27/2008
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Title:
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SEMICONDUCTOR DEVICE WITH INCREASED I/O LEADFRAME
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Patent #:
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Issue Dt:
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09/20/2011
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Application #:
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12269357
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Filing Dt:
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11/12/2008
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Title:
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PACKAGE FAILURE PROGNOSTIC STRUCTURE AND METHOD
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Patent #:
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Issue Dt:
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11/30/2010
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Application #:
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12270690
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Filing Dt:
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11/13/2008
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Title:
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SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF
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Patent #:
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Issue Dt:
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01/03/2012
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Application #:
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12272606
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Filing Dt:
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11/17/2008
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Title:
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SEMICONDUCTOR DEVICE INCLUDING INCREASED CAPACITY LEADFRAME
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Patent #:
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Issue Dt:
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12/06/2011
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Application #:
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12273500
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Filing Dt:
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11/18/2008
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Title:
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SEMICONDUCTOR DEVICE WITH INCREASED I/O LEADFRAME INCLUDING PASSIVE DEVICE
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Patent #:
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Issue Dt:
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01/25/2011
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Application #:
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12276121
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Filing Dt:
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11/21/2008
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Title:
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SEMICONDUCTOR DEVICE INCLUDING LEADFRAME HAVING POWER BARS AND INCREASED I/O
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Patent #:
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Issue Dt:
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06/15/2010
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Application #:
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12291119
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Filing Dt:
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11/05/2008
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Title:
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STACKABLE SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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12/28/2010
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Application #:
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12291767
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Filing Dt:
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11/12/2008
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Title:
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STACKED FLIP CHIP DIE ASSEMBLY
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Patent #:
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Issue Dt:
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01/04/2011
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Application #:
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12317649
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Filing Dt:
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12/23/2008
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Publication #:
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Pub Dt:
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05/28/2009
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Title:
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ADHESIVE ON WIRE STACKED SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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03/29/2011
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Application #:
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12323124
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Filing Dt:
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11/25/2008
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Publication #:
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Pub Dt:
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05/27/2010
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Title:
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SYSTEM AND METHOD TO PROVIDE RF SHIELDING FOR A MEMS MICROPHONE PACKAGE
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Patent #:
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Issue Dt:
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03/06/2012
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Application #:
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12327716
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Filing Dt:
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12/03/2008
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Title:
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SHIELDING FOR A SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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07/19/2011
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Application #:
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12327763
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Filing Dt:
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12/03/2008
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Title:
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PACKAGE IN PACKAGE SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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07/16/2013
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Application #:
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12330424
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Filing Dt:
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12/08/2008
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Title:
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PACKAGE IN PACKAGE SEMICONDUCTOR DEVICE WITH FILM OVER WIRE
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Patent #:
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Issue Dt:
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01/24/2012
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Application #:
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12330769
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Filing Dt:
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12/09/2008
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Title:
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SYSTEM AND METHOD FOR COMPARTMENTAL SHIELDING OF STACKED PACKAGES
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Patent #:
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Issue Dt:
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09/06/2011
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Application #:
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12335365
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Filing Dt:
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12/15/2008
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Title:
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SEMICONDUCTOR DEVICE HAVING EMI SHIELDING AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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01/10/2012
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Application #:
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12339772
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Filing Dt:
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12/19/2008
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Publication #:
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Pub Dt:
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06/25/2009
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Title:
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EXHAUST PURIFICATION APPARATUS FOR ENGINE
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Patent #:
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Issue Dt:
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09/13/2011
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Application #:
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12342386
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Filing Dt:
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12/23/2008
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Title:
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SEMICONDUCTOR PACKAGE HAVING A HEAT SPREADER WITH AN EXPOSED EXTERIOR SURFACE AND A TOP MOLD GATE
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Patent #:
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Issue Dt:
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12/14/2010
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Application #:
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12342829
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Filing Dt:
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12/23/2008
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Title:
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SYSTEM AND METHOD FOR SHIELDING OF PACKAGE ON PACKAGE (POP) ASSEMBLIES
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Patent #:
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Issue Dt:
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05/15/2012
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Application #:
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12342839
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Filing Dt:
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12/23/2008
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Title:
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PROTRUDING POST SUBSTRATE PACKAGE STRUCTURE AND METHOD
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Patent #:
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Issue Dt:
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03/25/2014
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Application #:
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12348853
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Filing Dt:
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01/05/2009
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Title:
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LEADFRAME STRUCTURE FOR CONCENTRATED PHOTOVOLTAIC RECEIVER PACKAGE
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Patent #:
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Issue Dt:
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10/28/2014
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Application #:
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12351596
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Filing Dt:
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01/09/2009
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Title:
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EXTENDED LANDING PAD SUBSTRATE PACKAGE STRUCTURE AND METHOD
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Patent #:
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Issue Dt:
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11/15/2011
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Application #:
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12351690
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Filing Dt:
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01/09/2009
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Title:
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PACKAGE IN PACKAGE DEVICE FOR RF TRANSCEIVER MODULE
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Patent #:
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Issue Dt:
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06/08/2010
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Application #:
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12365682
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Filing Dt:
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02/04/2009
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Title:
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ETCH SINGULATED SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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09/27/2011
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Application #:
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12390999
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Filing Dt:
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02/23/2009
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Title:
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REDUCED PROFILE STACKABLE SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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10/04/2011
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Application #:
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12397470
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Filing Dt:
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03/04/2009
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Title:
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REVERSIBLE TOP/BOTTOM MEMS PACKAGE
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Patent #:
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Issue Dt:
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06/14/2011
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Application #:
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12398089
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Filing Dt:
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03/04/2009
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Title:
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CONFORMAL SHIELD ON PUNCH QFN SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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04/19/2011
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Application #:
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12399600
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Filing Dt:
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03/06/2009
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Publication #:
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Pub Dt:
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07/02/2009
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Title:
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LEADFRAME FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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08/23/2011
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Application #:
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12405854
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Filing Dt:
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03/17/2009
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Title:
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ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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09/17/2013
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Application #:
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12414220
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Filing Dt:
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03/30/2009
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Title:
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FINE PITCH COPPER PILLAR PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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11/05/2013
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Application #:
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12419180
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Filing Dt:
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04/06/2009
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Title:
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SEMICONDUCTOR DEVICE WITH INCREASED I/O LEADFRAME INCLUDING POWER BARS
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