Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 015194/0865 | |
| Pages: | 4 |
| | Recorded: | 04/09/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
09/26/2006
|
Application #:
|
10731436
|
Filing Dt:
|
12/10/2003
|
Publication #:
|
|
Pub Dt:
|
07/29/2004
| | | | |
Title:
|
SOLDER BALL ASSEMBLY FOR BUMP FORMATION AND METHOD FOR ITS MANUFACTURE
|
|
Assignee
|
|
|
23 SENJU-HASHIDO-CHO |
ADACHI-KU, TOKYO 120-8555, JAPAN |
|
Correspondence name and address
|
|
MICHAEL TOBIAS
|
|
1717 K STREET N.W., SUITE 613
|
|
WASHINGTON, DC 20036
|
Search Results as of:
09/22/2024 06:51 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|