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Patent Assignment Details
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Reel/Frame:023246/0866   Pages: 5
Recorded: 09/17/2009
Attorney Dkt #:851663.483
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12495734
Filing Dt:
06/30/2009
Publication #:
Pub Dt:
07/01/2010
Title:
REDUCING WARPAGE FOR FAN-OUT WAFER LEVEL PACKAGING
Assignors
1
Exec Dt:
09/16/2009
2
Exec Dt:
09/16/2009
3
Exec Dt:
07/31/2009
Assignee
1
5A SERAGOON NORTH AVENUE 5
SINGAPORE, SINGAPORE 554574
Correspondence name and address
TIMOTHY L. BOLLER
701 FIFTH AVENUE
SUITE 5400
SEATTLE, WA 98104

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