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Reel/Frame:051080/0867   Pages: 4
Recorded: 11/21/2019
Attorney Dkt #:ZP146-0049-US-03
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
16553879
Filing Dt:
08/28/2019
Publication #:
Pub Dt:
03/05/2020
Title:
BOND ENHANCEMENT IN MICROELECTRONICS BY TRAPPING CONTAMINANTS AND ARRESTING CRACKS DURING DIRECT-BONDING PROCESSES
Assignors
1
Exec Dt:
09/26/2019
2
Exec Dt:
09/17/2019
3
Exec Dt:
09/17/2019
4
Exec Dt:
09/18/2019
5
Exec Dt:
09/18/2019
6
Exec Dt:
09/17/2019
7
Exec Dt:
09/18/2019
Assignee
1
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
Correspondence name and address
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY
ATTN: PATENT DEPARTMENT
SAN JOSE, CA 95134

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