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Patent Assignment Details
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Reel/Frame:019763/0868   Pages: 6
Recorded: 08/29/2007
Attorney Dkt #:10060762-01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/22/2011
Application #:
11847239
Filing Dt:
08/29/2007
Publication #:
Pub Dt:
03/05/2009
Title:
THROUGH-CHIP VIA INTERCONNECTS FOR STACKED INTEGRATED CIRCUIT STRUCTURES
Assignors
1
Exec Dt:
08/21/2007
2
Exec Dt:
08/21/2007
3
Exec Dt:
08/21/2007
4
Exec Dt:
08/22/2007
5
Exec Dt:
08/24/2007
Assignee
1
P.O. BOX 7599
LEGAL DEPARTMENT
LOVELAND, COLORADO 80537
Correspondence name and address
MARCELLA WILHITE
P.O. BOX 7599
MS DL429
LOVELAND, CO 80537

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