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Reel/Frame:051730/0868   Pages: 9
Recorded: 02/05/2020
Attorney Dkt #:PA01GETOIMBERATEK
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 26
1
Patent #:
Issue Dt:
11/13/2007
Application #:
10502336
Filing Dt:
09/23/2004
Publication #:
Pub Dt:
10/13/2005
Title:
METHOD FOR EMBEDDING A COMPONENT IN A BASE
2
Patent #:
Issue Dt:
01/31/2006
Application #:
10502340
Filing Dt:
09/23/2004
Publication #:
Pub Dt:
06/09/2005
Title:
METHOD FOR EMBEDDING A COMPONENT IN A BASE AND FORMING A CONTACT
3
Patent #:
Issue Dt:
11/27/2007
Application #:
10546820
Filing Dt:
08/25/2005
Publication #:
Pub Dt:
10/05/2006
Title:
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE
4
Patent #:
Issue Dt:
04/13/2010
Application #:
10572340
Filing Dt:
11/14/2006
Publication #:
Pub Dt:
07/19/2007
Title:
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE IN AN INSTALLATION BASE
5
Patent #:
Issue Dt:
08/14/2012
Application #:
11570673
Filing Dt:
06/30/2008
Publication #:
Pub Dt:
10/23/2008
Title:
METHOD FOR MANUFACTURING AN ELECTRONICS MODULE COMPRISING A COMPONENT ELECTRICALLY CONNECTED TO A CONDUCTOR-PATTERN LAYER
6
Patent #:
Issue Dt:
12/13/2011
Application #:
11587694
Filing Dt:
02/09/2007
Publication #:
Pub Dt:
10/04/2007
Title:
HEAT CONDUCTION FROM AN EMBEDDED COMPONENT
7
Patent #:
Issue Dt:
03/09/2010
Application #:
11659190
Filing Dt:
02/02/2007
Publication #:
Pub Dt:
12/04/2008
Title:
MANUFACTURE OF A LAYER INCLUDING A COMPONENT
8
Patent #:
Issue Dt:
11/22/2011
Application #:
11667429
Filing Dt:
05/09/2007
Publication #:
Pub Dt:
11/22/2007
Title:
METHOD FOR MANUFACTURING AN ELECTRONICS MODULE
9
Patent #:
Issue Dt:
10/01/2013
Application #:
11791547
Filing Dt:
09/28/2007
Publication #:
Pub Dt:
04/24/2008
Title:
ELECTRONICS MODULE AND METHOD FOR MANUFACTURING THE SAME
10
Patent #:
Issue Dt:
08/14/2012
Application #:
11917711
Filing Dt:
04/28/2008
Publication #:
Pub Dt:
08/21/2008
Title:
METHOD FOR MANUFACTURING A CIRCUIT BOARD
11
Patent #:
Issue Dt:
07/24/2012
Application #:
11917724
Filing Dt:
04/28/2008
Publication #:
Pub Dt:
01/15/2009
Title:
METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE, AND A CIRCUIT BOARD STRUCTURE
12
Patent #:
Issue Dt:
11/12/2013
Application #:
11917737
Filing Dt:
04/28/2008
Publication #:
Pub Dt:
08/28/2008
Title:
METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE
13
Patent #:
Issue Dt:
03/24/2015
Application #:
12293412
Filing Dt:
09/17/2008
Publication #:
Pub Dt:
05/28/2009
Title:
MANUFACTURE OF A CIRCUIT BOARD CONTAINING A COMPONENT
14
Patent #:
Issue Dt:
10/16/2012
Application #:
12420617
Filing Dt:
04/08/2009
Publication #:
Pub Dt:
10/22/2009
Title:
METHOD OF MANUFACTURING A WIRING BOARD
15
Patent #:
Issue Dt:
02/25/2014
Application #:
12506519
Filing Dt:
07/21/2009
Publication #:
Pub Dt:
03/04/2010
Title:
MULTI-CHIP PACKAGE AND MANUFACTURING METHOD
16
Patent #:
Issue Dt:
01/21/2014
Application #:
12546454
Filing Dt:
08/24/2009
Publication #:
Pub Dt:
02/25/2010
Title:
CIRCUIT BOARD STRUCTURE COMPRISING AN ELECTRICAL COMPONENT AND A METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE COMPRISING AN ELECTRICAL COMPONENT
17
Patent #:
Issue Dt:
08/23/2016
Application #:
12652399
Filing Dt:
01/05/2010
Publication #:
Pub Dt:
07/08/2010
Title:
RIGID-FLEX MODULE AND MANUFACTURING METHOD
18
Patent #:
Issue Dt:
02/24/2015
Application #:
12700812
Filing Dt:
02/05/2010
Publication #:
Pub Dt:
08/12/2010
Title:
ELECTRONIC MODULE WITH EMI PROTECTION
19
Patent #:
Issue Dt:
08/07/2012
Application #:
12842052
Filing Dt:
07/23/2010
Publication #:
Pub Dt:
01/26/2012
Title:
ELECTRONIC MODULE WITH VERTICAL CONNECTOR BETWEEN CONDUCTOR PATTERNS
20
Patent #:
Issue Dt:
05/27/2014
Application #:
12842055
Filing Dt:
07/23/2010
Publication #:
Pub Dt:
01/26/2012
Title:
ELECTRONIC MODULE WITH EMBEDDED JUMPER CONDUCTOR
21
Patent #:
Issue Dt:
08/16/2016
Application #:
12872538
Filing Dt:
08/31/2010
Publication #:
Pub Dt:
03/01/2012
Title:
METHOD FOR CONTROLLING WARPAGE WITHIN ELECTRONIC PRODUCTS AND AN ELECTRONIC PRODUCT
22
Patent #:
Issue Dt:
04/15/2014
Application #:
12990785
Filing Dt:
11/03/2010
Publication #:
Pub Dt:
03/17/2011
Title:
CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
23
Patent #:
Issue Dt:
04/22/2014
Application #:
13118650
Filing Dt:
05/31/2011
Publication #:
Pub Dt:
12/01/2011
Title:
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND AN ELECTRONIC MODULE
24
Patent #:
Issue Dt:
03/29/2016
Application #:
13698670
Filing Dt:
03/25/2013
Publication #:
Pub Dt:
07/11/2013
Title:
MANUFACTURING METHOD AND ELECTRONIC MODULE WITH NEW ROUTING POSSIBILITIES
25
Patent #:
Issue Dt:
06/12/2018
Application #:
14569900
Filing Dt:
12/15/2014
Publication #:
Pub Dt:
06/16/2016
Title:
METHOD FOR FABRICATION OF AN ELECTRONIC MODULE AND ELECTRONIC MODULE
26
Patent #:
Issue Dt:
06/07/2016
Application #:
14623569
Filing Dt:
02/17/2015
Publication #:
Pub Dt:
06/11/2015
Title:
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND AN ELECTRONIC MODULE
Assignor
1
Exec Dt:
01/13/2020
Assignee
1
13921 PARK CENTER RD, SUITE 380
HERNDON, VIRGINIA 20171
Correspondence name and address
YEASUN YOON
20319 KIAWAH ISLAND DR
ASHBURN, VA 20147

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