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Reel/Frame:066355/0868   Pages: 3
Recorded: 01/19/2024
Attorney Dkt #:T103838US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18416432
Filing Dt:
01/18/2024
Publication #:
Pub Dt:
07/24/2025
Title:
IC PACKAGE WITH DIE AND COPPER POSTS
Assignors
1
Exec Dt:
01/16/2024
2
Exec Dt:
01/17/2024
3
Exec Dt:
01/17/2024
Assignee
1
12500 TI BOULEVARD
M/S 3999
DALLAS, TEXAS 75243
Correspondence name and address
TEXAS INSTRUMENTS INCORPORATED
12500 TI BOULEVARD
M/S 3999
DALLAS, TX 75243

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