Total properties:
51
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Patent #:
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Issue Dt:
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06/02/1987
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Application #:
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06582079
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Filing Dt:
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02/17/1984
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Title:
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INTEGRATED CIRCUIT CHIP AND SUBSTRATE ASSEMBLY
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Patent #:
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Issue Dt:
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10/27/1987
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Application #:
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06719533
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Filing Dt:
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04/03/1985
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Title:
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INTERCONNECTION LINES FOR WAFER-SCALE-INTEGRATED ASSEMBLIES
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Patent #:
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Issue Dt:
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05/17/1988
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Application #:
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07009634
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Filing Dt:
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01/23/1987
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Title:
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DECENTRALIZED BUS ARBITRATION USING DISTRIBUTED ARBITERS HAVING CIRCUITRY FOR LATCHING LOCKOUT SIGNALS GATE FROM HIGHER PRIORITY ARBITERS
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Patent #:
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Issue Dt:
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01/30/1990
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Application #:
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07227220
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Filing Dt:
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08/02/1988
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Title:
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OPTICAL FIBER SWITCH
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Patent #:
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Issue Dt:
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02/26/1991
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Application #:
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07394911
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Filing Dt:
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08/17/1989
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Title:
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OPTICAL ASSEMBLY COMPRISING OPTICAL FIBER COUPLING MEANS
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Patent #:
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Issue Dt:
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03/19/1991
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Application #:
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07431941
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Filing Dt:
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11/06/1989
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Title:
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OPTICAL FIBER SWITCH
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Patent #:
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Issue Dt:
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08/27/1991
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Application #:
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07587308
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Filing Dt:
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09/24/1990
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Title:
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INTEGRATED CIRCUIT PACKAGE AND COMPACT ASSEMBLIES THEREOF
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Patent #:
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Issue Dt:
|
09/29/1992
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Application #:
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07724561
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Filing Dt:
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06/28/1991
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Title:
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SOLDER PASTE
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Patent #:
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Issue Dt:
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06/30/1992
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Application #:
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07787290
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Filing Dt:
|
11/04/1991
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Title:
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METHOD OF SOLDERING INCLUDING REMOVAL OF FLUX RESIDUE
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Patent #:
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Issue Dt:
|
03/30/1993
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Application #:
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07792559
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Filing Dt:
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11/15/1991
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Title:
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BONDING METHOD USING SOLDER COMPOSED OF MULTIPLE ALTERNATING GOLD AND TIN LAYERS
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Patent #:
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Issue Dt:
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11/23/1993
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Application #:
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07809694
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Filing Dt:
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12/17/1991
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Title:
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PSEUDO-ELECTROLESS, FOLLOWED BY ELECTROLESS, METALLIZATION OF NICKEL ON METALLIC WIRES, AS FOR SEMICONDUCTOR CHIP-TO-CHIP INTERCONNECTIONS
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Patent #:
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Issue Dt:
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08/10/1993
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Application #:
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07938194
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Filing Dt:
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08/28/1992
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Title:
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DEBONDABLE METALLIC BONDING METHOD
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Patent #:
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Issue Dt:
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08/10/1993
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Application #:
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07938195
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Filing Dt:
|
08/28/1992
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Title:
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PERMANENT METALLIC BONDING METHOD
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Patent #:
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Issue Dt:
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06/20/2000
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Application #:
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07940157
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Filing Dt:
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09/03/1992
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Title:
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METHOD FOR ASSEMBLING MULTICHIP MODULES
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Patent #:
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Issue Dt:
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05/18/1993
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Application #:
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07973908
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Filing Dt:
|
11/10/1992
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Title:
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SOLDER PASTE AND METHOD OF USING THE SAME
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|
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Patent #:
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Issue Dt:
|
05/03/1994
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Application #:
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08054505
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Filing Dt:
|
04/27/1993
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Title:
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METHOD OF MAKING AN ARTICLE COMPRISING SOLDER BUMP BONDING
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|
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Patent #:
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|
Issue Dt:
|
09/13/1994
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Application #:
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08128492
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Filing Dt:
|
09/28/1993
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Title:
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SURFACE MOUNT SOLDER ASSEMBLY OF LEADLESS INTEGRATED CIRCUIT PACKAGES TO SUBSTRATES
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Patent #:
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Issue Dt:
|
01/31/1995
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Application #:
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08158131
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Filing Dt:
|
11/24/1993
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Title:
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SOLDERING MATERIAL AND PROCEDURE
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|
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Patent #:
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|
Issue Dt:
|
10/24/1995
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Application #:
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08200986
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Filing Dt:
|
02/24/1994
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Title:
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MULTI-CHIP MODULES HAVING CHIP-TO-CHIP INTERCONNECTIONS WITH REDUCED SIGNAL VOLTAGE LEVEL AND SWING
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Patent #:
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|
Issue Dt:
|
01/17/1995
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Application #:
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08216225
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Filing Dt:
|
03/22/1994
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Title:
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SOLDER PASTE MIXTURE
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|
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Patent #:
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|
Issue Dt:
|
05/14/1996
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Application #:
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08220771
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Filing Dt:
|
03/31/1994
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Title:
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PROCESS FOR FABRICATING AN INTEGRATED CIRCUIT
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Patent #:
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|
Issue Dt:
|
12/05/1995
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Application #:
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08260859
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Filing Dt:
|
06/16/1994
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Title:
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ELECTRONIC DEVICE PACKAGE HAVING ELECTRONIC DEVICE BONDED, AT A LOCALIZED REGION THEREOF, TO CIRCUIT BOARD
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Patent #:
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|
Issue Dt:
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04/09/1996
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Application #:
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08333168
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Filing Dt:
|
11/02/1994
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Title:
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METHOD FOR BUMPING SILICON DEVICES
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|
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Patent #:
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|
Issue Dt:
|
01/02/1996
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Application #:
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08344393
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Filing Dt:
|
11/23/1994
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Title:
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TEMPORARY CONNECTIONS FOR FAST ELECTRICAL ACCESS TO ELECTRONIC DEVICES
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Patent #:
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|
Issue Dt:
|
07/09/1996
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Application #:
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08370902
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Filing Dt:
|
01/10/1995
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Title:
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METHOD FOR MAKING MULTICHIP CIRCUITS USING ACTIVE SEMICONDUCTOR SUBSTRATES
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|
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Patent #:
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|
Issue Dt:
|
03/04/1997
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Application #:
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08393628
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Filing Dt:
|
02/24/1995
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Title:
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PACKAGING MULTI-CHIP MODULES WITHOUT WIRE-BOND INTERCONNECTION
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|
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Patent #:
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|
Issue Dt:
|
04/22/1997
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Application #:
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08438296
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Filing Dt:
|
05/10/1995
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Title:
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BONDING SCHEME USING GROUP VB METALLIC LAYER
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Patent #:
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|
Issue Dt:
|
02/22/2000
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Application #:
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08477175
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Filing Dt:
|
06/07/1995
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Title:
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SELF-CONTAINED MEMORY APPARATUS HAVING DIVERSE TYPES OF MEMORY AND DISTRIBUTED CONTROL
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Patent #:
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|
Issue Dt:
|
10/15/1996
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Application #:
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08479587
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Filing Dt:
|
06/07/1995
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Title:
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METHOD AND APPARATUS FOR ASSEMBLING MULTICHIP MODULES
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|
|
Patent #:
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|
Issue Dt:
|
12/16/1997
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Application #:
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08534909
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Filing Dt:
|
09/28/1995
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Title:
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CURBSIDE CIRCUITRY FOR INTERACTIVE COMMUNICATION SERVICES
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|
|
Patent #:
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|
Issue Dt:
|
06/16/1998
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Application #:
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08567659
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Filing Dt:
|
12/05/1995
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Title:
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ELECTRONIC DEVICE PACKAGE ENCLOSED BY PLIANT MEDIUM LATERALLY CONFINED BY A PLASTIC RIM MEMBER
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|
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Patent #:
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|
Issue Dt:
|
11/10/1998
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Application #:
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08586347
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Filing Dt:
|
01/16/1996
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Title:
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METHOD AND APPARATUS FOR FORMING FINE PATTERNS ON PRINTED CIRCUIT BOARD
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|
|
Patent #:
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|
Issue Dt:
|
07/08/1997
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Application #:
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08697121
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Filing Dt:
|
08/20/1996
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Title:
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THIN PACKAGING OF MULTI-CHIP MODULES WITH ENHANCED THERMAL POWER MANAGEMENT
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|
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Patent #:
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|
Issue Dt:
|
05/05/1998
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Application #:
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08761047
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Filing Dt:
|
12/05/1996
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Title:
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MULTI-CHIP MODULES WITH ISOLATED COUPLING BETWEEN MODULES
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|
|
Patent #:
|
|
Issue Dt:
|
07/14/1998
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Application #:
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08803474
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Filing Dt:
|
02/20/1997
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Title:
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CLEANING SOLDER-BONDED FLIP-CHIP ASSEMBLIES
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|
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Patent #:
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|
Issue Dt:
|
05/18/1999
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Application #:
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08825923
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Filing Dt:
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04/02/1997
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Title:
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FLIP CHIP METALLIZATION
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|
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Patent #:
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|
Issue Dt:
|
11/23/1999
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Application #:
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08866264
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Filing Dt:
|
05/30/1997
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Title:
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FLIP CHIP PACKAGING OF MEMORY CHIPS
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|
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Patent #:
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Issue Dt:
|
02/09/1999
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Application #:
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08896917
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Filing Dt:
|
07/18/1997
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Title:
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RF IC PACKAGE
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|
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Patent #:
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|
Issue Dt:
|
02/01/2000
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Application #:
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08939053
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Filing Dt:
|
09/26/1997
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Title:
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METHOD OF PACKAGING FRAGILE DEVICES WITH A GEL MEDIUM CONFINED BY A RIM MEMBER
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|
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Patent #:
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Issue Dt:
|
04/27/1999
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Application #:
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08946980
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Filing Dt:
|
10/08/1997
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Title:
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CHIP-ON-CHIP IC PACKAGES
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Patent #:
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|
Issue Dt:
|
03/28/2000
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Application #:
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08991867
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Filing Dt:
|
12/16/1997
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Title:
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METHOD FOR TESTING INTEGRATED CIRCUITS
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|
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Patent #:
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|
Issue Dt:
|
06/13/2000
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Application #:
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09012304
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Filing Dt:
|
01/23/1998
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Title:
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MCM WITH HIGH Q OVERLAPPING RESONATOR
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|
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Patent #:
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|
Issue Dt:
|
01/18/2000
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Application #:
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09032338
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Filing Dt:
|
02/27/1998
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Title:
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MANUFACTURE OF FLIP-CHIP DEVICE
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|
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Patent #:
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|
Issue Dt:
|
01/11/2000
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Application #:
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09041157
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Filing Dt:
|
03/12/1998
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Title:
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SOLDER BONDING PRINTED CIRCUIT BOARDS
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|
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Patent #:
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|
Issue Dt:
|
08/08/2000
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Application #:
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09067271
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Filing Dt:
|
04/27/1998
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Title:
|
SOLDER BONDING PRINTED CIRCUIT BOARDS
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|
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Patent #:
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|
Issue Dt:
|
10/19/1999
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Application #:
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09085643
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Filing Dt:
|
05/27/1998
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Title:
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HIGH SPEED FLIP-CHIP DISPENSING
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|
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Patent #:
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Issue Dt:
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11/28/2000
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Application #:
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09120148
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Filing Dt:
|
07/21/1998
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Title:
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RECESSED FLIP-CHIP PACKAGE
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Patent #:
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Issue Dt:
|
03/27/2001
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Application #:
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09134843
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Filing Dt:
|
08/14/1998
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Title:
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HIGH SPEED FLIP-CHIP DISPENSING
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Patent #:
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Issue Dt:
|
12/12/2000
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Application #:
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09149804
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Filing Dt:
|
09/08/1998
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Title:
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TRANSLATOR FOR RECESSED FLIP-CHIP PACKAGE
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|
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Patent #:
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Issue Dt:
|
06/13/2000
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Application #:
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09238706
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Filing Dt:
|
01/28/1999
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Title:
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INTEGRATED CIRCUIT BONDING METHOD AND APPARATUS
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|
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Patent #:
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Issue Dt:
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Application #:
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UNAVAILABLE
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Filing Dt:
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Title:
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