Patent Assignment Details
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Reel/Frame: | 038398/0870 | |
| Pages: | 6 |
| | Recorded: | 04/27/2016 | | |
Attorney Dkt #: | SNIP.0017US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/13/2017
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Application #:
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15140452
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Filing Dt:
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04/27/2016
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Publication #:
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Pub Dt:
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04/27/2017
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Title:
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Method For Wafer-Level Chip Scale Package Testing
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Assignee
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NO. 2 XINHUIHUAN ROAD |
NEW DISTRICT |
WUXI, CHINA 214028 |
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Correspondence name and address
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HAN IP CORPORATION
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4790 IRVINE BOULEVARD SUITE 105-347
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IRVINE, CA 92620
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