Patent Assignment Details
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Reel/Frame: | 012894/0871 | |
| Pages: | 2 |
| | Recorded: | 05/10/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/16/2004
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Application #:
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10142453
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Filing Dt:
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05/10/2002
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Publication #:
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Pub Dt:
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04/24/2003
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Title:
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PACKAGE OF SEMICONDUCTOR CHIP WITH ARRAY-TYPE BONDING PADS
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Assignee
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SHINTAI 5TH RD. |
21 FL., NO. 88, SEC 1, |
SHIJR CITY, TAIPEI, TAIWAN R.O.C |
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Correspondence name and address
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LADAS & PARRY
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RICHARD P. BERG
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5870 WILSHIRE BOULEVARD #2100
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LOS ANGELES, CA 90036-5679
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