Patent Assignment Details
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| Reel/Frame: | 031594/0871 | |
| Pages: | 4 |
| | Recorded: | 11/13/2013 | | |
| Attorney Dkt #: | GUA-0260-SF |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/09/2014
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Application #:
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14079075
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Filing Dt:
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11/13/2013
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Publication #:
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Pub Dt:
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05/22/2014
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Title:
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METHOD FOR ELECTRICALLY CONNECTING WAFERS USING BUTTING CONTACT STRUCTURE AND SEMICONDUCTOR DEVICE FABRICATED THROUGH THE SAME
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Assignee
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| 20F BUNDANG SQUARE, 263 SEOHYEON-DONG, BUNDANG-GU |
| SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 463-050 |
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Correspondence name and address
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KILE PARK REED & HOUTTEMAN PLLC
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1200 NEW HAMPSHIRE AVE. NW
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SUITE 570
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WASHINGTON, DC 20036
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