Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 031594/0871 | |
| Pages: | 4 |
| | Recorded: | 11/13/2013 | | |
Attorney Dkt #: | GUA-0260-SF |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
12/09/2014
|
Application #:
|
14079075
|
Filing Dt:
|
11/13/2013
|
Publication #:
|
|
Pub Dt:
|
05/22/2014
| | | | |
Title:
|
METHOD FOR ELECTRICALLY CONNECTING WAFERS USING BUTTING CONTACT STRUCTURE AND SEMICONDUCTOR DEVICE FABRICATED THROUGH THE SAME
|
|
Assignee
|
|
|
20F BUNDANG SQUARE, 263 SEOHYEON-DONG, BUNDANG-GU |
SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 463-050 |
|
Correspondence name and address
|
|
KILE PARK REED & HOUTTEMAN PLLC
|
|
1200 NEW HAMPSHIRE AVE. NW
|
|
SUITE 570
|
|
WASHINGTON, DC 20036
|
Search Results as of:
09/28/2024 08:37 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|