Patent Assignment Details
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| Reel/Frame: | 065611/0871 | |
| Pages: | 4 |
| | Recorded: | 11/18/2023 | | |
| Attorney Dkt #: | 815063.491USPC |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18247861
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Filing Dt:
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04/04/2023
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Publication #:
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Pub Dt:
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11/23/2023
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Title:
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METHOD FOR PRODUCING AN ELECTRONIC COMPONENT ASSEMBLY ON THE FRONT FACE OF A SEMI-CONDUCTOR WAFER
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Assignee
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| 7 PARVIS LOUIS NÈEL, BP 50 |
| GRENOBLE, FRANCE 38040 |
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Correspondence name and address
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TESSA MCCLURE
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701 FIFTH AVENUE, SUITE 5400
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SEED IP LAW GROUP LLP
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SEATTLE, WA 98104
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