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Patent Assignment Details

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Reel/Frame:	067534/0872			Pages:	11
		Recorded:	05/29/2024
Conveyance:	CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA FROM STATS CHIPPAC PTE. LTE. TO STATS CHIPPAC LTD. AND CORRECT THE NAME OF RECEIVING PARTY DATA FROM STATS CHIPPAC PTE. LTE. TO STATS CHIPPAC PTE. LTD. PREVIOUSLY RECORDED AT REEL: 64838 FRAME: 948. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME.

Total properties: 13

Patent #:	7671463	Issue Dt:	03/02/2010	Application #:	11277991	Filing Dt:	03/30/2006
Publication #:	US20070235854	Pub Dt:	10/11/2007
Title:	INTEGRATED CIRCUIT PACKAGE SYSTEM WITH GROUND RING

Patent #:	7737539	Issue Dt:	06/15/2010	Application #:	11306854	Filing Dt:	01/12/2006
Publication #:	US20070158806	Pub Dt:	07/12/2007
Title:	INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING

Patent #:	7741707	Issue Dt:	06/22/2010	Application #:	11307906	Filing Dt:	02/27/2006
Publication #:	US20070200230	Pub Dt:	08/30/2007
Title:	STACKABLE INTEGRATED CIRCUIT PACKAGE SYSTEM

Patent #:	7723146	Issue Dt:	05/25/2010	Application #:	11326206	Filing Dt:	01/04/2006
Publication #:	US20070166867	Pub Dt:	07/19/2007
Title:	INTEGRATED CIRCUIT PACKAGE SYSTEM WITH IMAGE SENSOR SYSTEM

Patent #:	7746656	Issue Dt:	06/29/2010	Application #:	11383407	Filing Dt:	05/15/2006
Publication #:	US20060256525	Pub Dt:	11/16/2006
Title:	OFFSET INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM

Patent #:	7732907	Issue Dt:	06/08/2010	Application #:	11421051	Filing Dt:	05/30/2006
Publication #:	US20070278660	Pub Dt:	12/06/2007
Title:	INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EDGE CONNECTION SYSTEM

Patent #:	7683461	Issue Dt:	03/23/2010	Application #:	11459320	Filing Dt:	07/21/2006
Publication #:	US20080096401	Pub Dt:	04/24/2008
Title:	INTEGRATED CIRCUIT LEADLESS PACKAGE SYSTEM

Patent #:	7667308	Issue Dt:	02/23/2010	Application #:	11459568	Filing Dt:	07/24/2006
Publication #:	US20080017957	Pub Dt:	01/24/2008
Title:	LEADED STACKED PACKAGES HAVING INTEGRATED UPPER LEAD

Patent #:	7687919	Issue Dt:	03/30/2010	Application #:	11463855	Filing Dt:	08/10/2006
Publication #:	US20070108621	Pub Dt:	05/17/2007
Title:	INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ARCHED PEDESTAL

Patent #:	7659633	Issue Dt:	02/09/2010	Application #:	11640534	Filing Dt:	12/14/2006
Publication #:	US20070241464	Pub Dt:	10/18/2007
Title:	SOLDER JOINT FLIP CHIP INTERCONNECTION HAVING RELIEF STRUCTURE

Patent #:	7741726	Issue Dt:	06/22/2010	Application #:	12336141	Filing Dt:	12/16/2008
Publication #:	US20090096112	Pub Dt:	04/16/2009
Title:	INTEGRATED CIRCUIT UNDERFILL PACKAGE SYSTEM

Patent #:	7718472	Issue Dt:	05/18/2010	Application #:	12409491	Filing Dt:	03/24/2009
Publication #:	US20090179312	Pub Dt:	07/16/2009
Title:	INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM AND METHOD OF MANUFACTURE THEREOF

Assignor

Exec Dt:

03/29/2016

Assignee

5 YISHUN STREET 23

SINGAPORE, SINGAPORE

Correspondence name and address
	YANGZHOU DU
	8407 CENTRAL AVE, SUITE 2077
	NEWARK, CA 94560-3431

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