Patent Assignment Details
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| Reel/Frame: | 007406/0873 | |
| Pages: | 2 |
| | Recorded: | 02/15/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/02/1997
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Application #:
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08276511
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Filing Dt:
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07/14/1994
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Title:
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COMBINING TRENCH AND FIELD ISOLATION STRUCTURE FOR SEMICONDUCTOR DEVICES
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Assignee
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| MAIL STOP 507 PATENT DEPARTMENT |
| 2805 E. COLUMBIA ROAD BOISE, ID 83706 |
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Correspondence name and address
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STEVEN R. ORMISTON
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350 N. 9TH STREET
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P.O. BOX 2894
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BOISE, ID 83701
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