Patent Assignment Details
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Reel/Frame: | 054803/0873 | |
| Pages: | 3 |
| | Recorded: | 01/04/2021 | | |
Attorney Dkt #: | 1314/306A |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/10/2023
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Application #:
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17140952
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Filing Dt:
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01/04/2021
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Publication #:
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Pub Dt:
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07/08/2021
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Title:
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CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignee
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9F., NO. 23, JILIN RD. |
ZHONGLI DIST. |
TAOYUAN CITY, TAIWAN 320 |
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Correspondence name and address
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WEN LIU
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350 S. FIGUEROA STREET, SUITE 975
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LOS ANGELES, CA 90071
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09/23/2024 03:06 PM
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