Patent Assignment Details
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| Reel/Frame: | 062574/0873 | |
| Pages: | 3 |
| | Recorded: | 02/02/2023 | | |
| Attorney Dkt #: | 08380-P0340A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18104982
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Filing Dt:
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02/02/2023
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Publication #:
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Pub Dt:
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11/30/2023
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Title:
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INTEGRATED WAFER DEBONDING AND CLEANING APPARATUS AND DEBONDING AND CLEANING METHOD
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Assignee
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| NO. 89, SEC. 6, ZHONGHUA RD., XIANGSHAN DIST. |
| HSINCHU CITY, TAIWAN 30095 |
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Correspondence name and address
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THE ROY GROSS LAW FIRM, LLC
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101 MERRITT 7
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SUITE 300
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NORWALK, CT 06851
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