Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058585/0874 | |
| Pages: | 3 |
| | Recorded: | 01/07/2022 | | |
| Attorney Dkt #: | 1012-3165 / 2020P04033 US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17531867
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Filing Dt:
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11/22/2021
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Publication #:
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Pub Dt:
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06/02/2022
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Title:
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CHIP PACKAGE AND SEMICONDUCTOR ARRANGEMENT HAVING THERMALLY CONDUCTIVE MATERIAL IN CONTACT WITH A SEMICONDUCTOR CHIP AND METHODS OF FORMING THEREOF
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Assignee
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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MURPHY BILAK & HOMILLER/INFINEON TECHNO
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1255 CRESCENT GREEN
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CARY, NC 27518
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06/01/2024 04:14 PM
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