Patent Assignment Details
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Reel/Frame: | 039437/0876 | |
| Pages: | 3 |
| | Recorded: | 08/15/2016 | | |
Attorney Dkt #: | H20161082US1 (HGST166) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/19/2017
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Application #:
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15237345
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Filing Dt:
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08/15/2016
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Title:
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Wire Bonding Electrical Lapping Guides For Tape Head Module
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Assignee
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HERIKERBERGWEG 238 |
LUNA ARENA |
AMSTERDAM, NETHERLANDS 1101 CM |
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Correspondence name and address
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JOHN D. HENKHAUS
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7052 SANTA TERESA BLVD
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# 203
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SAN JOSE, CA 95139-1348
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