Patent Assignment Details
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| Reel/Frame: | 045941/0876 | |
| Pages: | 7 |
| | Recorded: | 05/31/2018 | | |
| Attorney Dkt #: | TF18HMK004 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/11/2020
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Application #:
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15993606
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Filing Dt:
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05/31/2018
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Publication #:
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Pub Dt:
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12/05/2019
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Title:
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Method of Redistribution Layer Routing for 2.5-Dimensional Integrated Circuit Packages
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Assignee
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| NO. 101, SEC. 2, KUANG-FU RD., |
| INNOVATION & INCUBATION HALL, NATIONAL TSING HUA UNIVERSITY |
| HSINCHU CITY, TAIWAN 30013 |
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Correspondence name and address
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CHIH FENG YEH
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188 OLD CASTLE POINT RD.
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WAPPINGERS FALLS, NY 12590-7069
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