Patent Assignment Details
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Reel/Frame: | 014691/0877 | |
| Pages: | 2 |
| | Recorded: | 11/12/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10704637
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Filing Dt:
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11/12/2003
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Publication #:
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Pub Dt:
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10/28/2004
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Title:
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Package structure and sensor module using the same
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Assignee
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TBI CENTER 152, #455-6, MASAN-RI, JINWI-MYON |
PYUNGTACK-SI |
451-865, KYONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MCDERMOTT, WILL & EMERY
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STEPHEN A. BECKER
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600 13TH STREET, N.W.
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WASHINGTON, DC 20005-3096
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06/21/2024 11:34 AM
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