Patent Assignment Details
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Reel/Frame: | 008945/0878 | |
| Pages: | 2 |
| | Recorded: | 01/12/1998 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/03/1999
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Application #:
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08882348
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Filing Dt:
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06/25/1997
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Title:
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METHOD OF FABRICATING DIRECT-BONDED SEMICONDUCTOR WAFERS
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Assignee
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2612 SHINOMIYA HIRATSUKA-SHI |
KANAGAWA, JAPAN |
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Correspondence name and address
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VARNDELL LEGAL GROUP
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R. EUGENE VARNDELL, JR.
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SUITE 220, 1150 S. WASHINGTON STREET
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ARLINGTON, VA 22314
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