Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 025627/0879 | |
| Pages: | 6 |
| | Recorded: | 01/12/2011 | | |
| Attorney Dkt #: | VNXP MATTERS |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
8
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Patent #:
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Issue Dt:
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10/08/1991
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Application #:
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07523443
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Filing Dt:
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05/14/1990
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Title:
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SYSTEM FOR ACHIEVING DESIRED BONDLENGTH OF ADHESIVE BETWEEN A SEMICONDUCTOR CHIP PACKAGE AND A HEATSINK
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Patent #:
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Issue Dt:
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04/06/1993
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Application #:
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07765597
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Filing Dt:
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09/26/1991
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Title:
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SYSTEM FOR ACHIEVING DESIRED BONDLENGTH OF ADHESIVE BETWEEN A SEMICONDUCTOR CHIP PACKAGE AND A HEATSINK
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Patent #:
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Issue Dt:
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01/20/1998
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Application #:
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08553113
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Filing Dt:
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11/07/1995
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Title:
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LEADFRAME BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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12/08/1998
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Application #:
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08554688
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Filing Dt:
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11/07/1995
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Title:
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MOLDED LEADFRAME BALL GRID ARRAY
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Patent #:
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Issue Dt:
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07/08/1997
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Application #:
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08581294
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Filing Dt:
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12/28/1995
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Title:
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ELECTRICALLY ENHANCED POWER QUAD FLAT PACK ARRANGEMENT
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Patent #:
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Issue Dt:
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09/01/1998
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Application #:
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08847880
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Filing Dt:
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04/28/1997
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Title:
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ELECTRICALLY ENHANCED POWER QUAD FLAT PACK ARRANGEMENT
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Patent #:
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Issue Dt:
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07/04/2000
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Application #:
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09151172
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Filing Dt:
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09/10/1998
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Title:
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MOLDED LEAD FRAME BALL GRID ARRAY
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Patent #:
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Issue Dt:
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02/20/2001
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Application #:
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09306517
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Filing Dt:
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05/06/1999
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Title:
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PACKAGE STRUCTURE FOR LOW COST AND ULTRA THIN CHIP SCALE PACKAGE
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Assignee
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| 2711 CENTERVILLE ROAD, SUITE 400 |
| ATTN: DEPT. 307 |
| WILMINGTON, DELAWARE 19808 |
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Correspondence name and address
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THOMAS E. WATSON
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127 PUBLIC SQUARE
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57TH FLOOR, KEY TOWER
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CLEVELAND, OH 44114
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