Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 065915/0883 | |
| Pages: | 5 |
| | Recorded: | 12/19/2023 | | |
| Attorney Dkt #: | 050083-0711 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18572127
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Filing Dt:
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12/19/2023
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Publication #:
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Pub Dt:
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08/29/2024
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICES
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Assignee
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| 158-1 OAZA SAYAMAGAHARA, IRUMA-SHI |
| SAITAMA, JAPAN 358-0032 |
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Correspondence name and address
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RIMON PC - MWE
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8300 GREENSBORO DR.
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SUITE 500
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MCLEAN, VA 22102
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08/21/2025 07:22 PM
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