Patent Assignment Details
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| Reel/Frame: | 022985/0885 | |
| Pages: | 3 |
| | Recorded: | 07/11/2009 | | |
| Attorney Dkt #: | IMT-MONORAIDIV |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/14/2011
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Application #:
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12459956
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Filing Dt:
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07/11/2009
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Publication #:
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Pub Dt:
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01/07/2010
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Title:
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WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH RAISED FEATURE
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Assignee
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| 75 ROBIN HILL ROAD |
| GOLETA, CALIFORNIA 93117 |
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Correspondence name and address
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JAQUELIN K. SPONG
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2139 DOMINION WAY
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FALLS CHURCH, VA 22043
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